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NUF6105FC 6 Channel EMI Pi-Filter Array with ESD Protection
This device is a 6 channel EMI filter array for data lines. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection - clamping transients from static discharges to protect delicate data line circuitry.
Features http://onsemi.com CIRCUIT DESCRIPTION
R1 A1 D1 C1 R2 A2 D3 C3 R3 A3 D5 C5 R4 A4 D7 C7 R5 A5 C5 D9 Symbol VPP 30 30 16 PR PT TJ Top Tstg 100 600 150 -40 to +85 -55 to +150 mW mW C C C NUF6105AYWWG G A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) Value Unit kV A6 D11 C11 C12 D12 B3 C9 C10 R6 C6 D10 C8 D8 B2 C4 C6 D6 C3 C4 D4 B1 C2 C2 D2 C1
* * * * * * * * * * *
EMI Filtering and ESD Protection for Data Lines Integration of 30 Discretes Offers Cost and Space Savings Exceeds IEC61000-4-2 (Level 4) Specifications Low Profile Flip-Chip Packaging MSL 1 Pb-Free Package is Available EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players
Typical Applications
MAXIMUM RATINGS (TA = 25C)
Rating ESD Discharge IEC61000-4-2, - Air Discharge - Contact Discharge Human Body Model DC Power per Resistor DC Power per Package Junction Temperature Operating Temperature Range Storage Temperature Range
FLIP-CHIP CASE 499D PLASTIC
A1 MARKING DIAGRAM
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
ORDERING INFORMATION
Device NUF6105FCT1 NUF6105FCT1G Package Flip-Chip Flip-Chip (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2005
1
August, 2005 - Rev. 3
Publication Order Number: NUF6105FC/D
NUF6105FC
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol VRWM VBR IR RI/O Cd Characteristic Maximum Reverse Working Voltage IZ = 10 mA VRWM = 3.3 V per line IR = 20 mA VR = 2.5 V, f = 1 MHz (Note 1 and 2) Min - 6.0 - 80 - Typ - 7.0 - 100 27 Max 5.0 8.0 0.1 120 - Unit V V mA W pF
1. Measured at 25C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the diode capacitance (Cd).
TYPICAL PERFORMANCE CURVES
0 -5 -10 -15 S21 (dB) S41 (dB) -20 -25 -30 -35 -40 -45 -50 10 Channel 3 or Channel 4 100 1000 10000 -70 -80 10 Channel 2 or Channel 5 Channel 1 or Channel 6 -30 -40 Channel 1 to Channel 2 -50 -60 (TA = 25C unless otherwise specified) 0 -10 -20 Channel 3 to Channel 4
100
1000
10000
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 1. Insertion Loss Curve (S21 Measurement)
Figure 2. Analog Crosstalk Curve (S41 Measurement)
2.0 NORMALIZED CAPACITANCE
105 104
1.5 RESISTANCE (W) 0 1.0 2.0 3.0 4.0 5.0
103 102 101 100 99 98 97 96
1.0
0.5
0
95 -40 -15 10 35 60 85 TEMPERATURE (C)
REVERSE VOLTAGE (V)
Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V)
Figure 4. Resistance Over Temperature
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NUF6105FC
D: 6.92 V @: 6.92 V
Figure 5. ESD Scope Trace Human Body Model (-8 kV)
D: 900 V @: -900 V
Figure 6. ESD Scope Trace Human Body Model (+8 kV)
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NUF6105FC
Printed Circuit Board Recommendations
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 500 mm Pitch 300 mm Solder Ball 250 mm +25 250 mm -0 Round NSMD 350 mm 25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 7. Solder Mask versus Non-Solder Mask Definition
Controlled Atmosphere 250 225C Min 235C Max 200 TEMPERATURE (C) 183 C 150 140 to 160 C 100 2 to 5 C/s
50 0 0 1 to 5 C/s 1 2 3 4 5
1 to 2 min 30-100 sec TIME (minutes)
Figure 8. Solder Reflow Profile
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NUF6105FC
PACKAGE DIMENSIONS
15 PIN FLIPCHIP CSP CASE 499D-01 ISSUE O
4X
D 0.10 C
A
B
TERMINAL A1 LOCATOR
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX --- 0.700 0.210 0.270 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.340 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC
0.10 C A2 0.05 C
SEATING PLANE
C 15 X
b
B A 1 2 3 4 5 6
0.05 C A B 0.03 C
EE EE
D1 e /2 e e1 5
E
DIM A A1 A2 D E b e e1 D1 E1
A1 C
A
E1
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NUF6105FC
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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NUF6105FC/D

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